Gr1 Titanium Hemispherical Head
Standard: ASME VIII-I, DIN28013
Material: GR1, GR2, GR7, GR12
Size: Customized
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Gr1 Titanium Hemispherical Head
The Hemispherical Head is a pipe fitting welded on the pipe end or installed on the external thread of the pipe end to cover and block the pipe, which is used to close the pipeline. The diameter of the official cap is generally within DN300, which is mainly used on the pipeline to strengthen the connection with the pipeline or as a blocking plate, and is not used as a main pressure component.
| Product Name | B265 Gr.1 Titanium and Carbon Steel Clad Dished Head | Shape | 2:1 Elliptical Head |
| Cladding Metal | B265 Gr.1 | Production Code | UG-81 |
| Base Metal | A516 Gr.70 | Storage Medium | Corrosive |
| Size | (3+20)*ID4100*50.8mm | Inner Surface Treatment | Auto Polished |
Table for available type of clad heads and cladded metals:
Product Names: | Explosion Bonded Clad Head for Pressure Vessels | ||
Production Codes: | ASME UG-81, etc. | ||
Type | Abbreviation | Available Clad Metals | Production Method |
Elliptical clad head | EHA, EHB | Titanium & Steel Clad Ferritic Stainless Steel & Steel Clad Austenitic (Duplex) Stainless Steel & Steel Clad Nickel Alloy & Steel Clad Zirconium & Steel Clad Tantalum & Steel Clad Copper & Steel Clad | Cold Pressing, Hot Pressing, Hot Spinning |
Standard Flange&Dished | DHA, DHB | ||
Dish only | PSH,SHD | ||
Flange reverse dished | WD | ||
Joggled head | DHD | ||
Conical | CHA,CHB,CHC,CHD | ||
Flange only | FH | ||
Hemispherical | HH | ||
Shallow Flange& Dished | MD,XD | ||
Approximate Elliptical | AH | ||
Dished and Flared | DF | ||
(Titanium dish head )DIN28013:

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Applications of titanium Elliptical Heads:

The materials of Elliptical Heads: The dish head can be made of various materials according to the material of the equipment body. For example, carbon steel (A3, 20#, Q235, Q345B, 16Mn, etc.), stainless steel (304, 321, 304L, 316, 316L, etc.), alloy steel (15Mo3 15CrMoV 35CrMoV 45CrMo), non-ferrous metals (aluminum, titanium, copper, nickel and nickel alloy, etc.). The material must be the same as that of the device.
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